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$18.5 Billion Chipmaking Project Collapses
Published on: 2021-03-05
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Wuhan Hongxin Semiconductor Manufacturing Co. Ltd. (HSMC), an $18.5 billion company that aimed to become one of China’s leading high-tech chipmakers, started dismissing employees as hopes for business resumption faded.
 

"Given the company's status quo, there is no plan for business resumption. All staff members have to submit resignation letters before Sunday and complete departure clearance before March 5. Those who are on a vacation can finish the process online".
 

HSMC, founded in November 2017, planned to make wafers with advanced logic technology in sizes of 7 nanometers and 14 nanometers. Each of the production lines was expected to make 30,000 pieces per month. The plan also called for a wafer-level advanced packaging production line.
 

However, the projects grounded to a halt in mid-2020 due to a lack of funds. In November 2020, it was had reportedly been fully taken over by the local unit of the State-owned Assets Supervision and Administration Commission of the State Council in Dongxihu district in Wuhan, Central China's Hubei Province.

Fu Liang, a Beijing-based telecom industry expert, said that the failure of the scale project is in part due to a hasty launch without a systemic and thorough planning, as well as deepen pre-investment investigations.
 

It's worth noting that the company has pledged an advanced lithography machine which it had bought from Dutch company ASML as mortgage to a bank for loans worth 580 million yuan ($89.61 million) at the end of 2019.
 

1280亿!千亿芯片猝死!招牌已撤 工地无人

主导“千亿芯片项目”的武汉弘芯,草草迎来了终局。
 

2月27日,集微网援引知情人士消息,武汉弘芯半导体现已开始遣散全体员工,其高层在微信群中留下了这样的一段话:
 

结合公司现状,公司无复工复产计划,经公司研究决定,请全体员工于 2021 年 2 月 28 日下班前提出离职申请,并于 2021 年 3 月 5 日下班前完成离职手续办理;休假人员可于线上办理。
 

而在三年前,弘芯还是知名的“国内造芯”顶流:总投资额达1280亿元,两度入选“湖北省重大项目”,在2019年,弘芯更是聘请前台积电二号人物、台湾半导体元老蒋尚义前来掌舵,并引入了ASML光刻机,一时风头无两。
 

但当这个“造芯顶流”不明不白地落幕后,我们才会真正反思弘芯带给我们的启示。

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