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Beijing International Packaging Fair
Published on: 2012-06-25
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 CHIPF2010 was strongly supported by many international packaging associations, such as WPO, APF and PPMA. The exhibition covers an area of 60,000 sqm and attracted about 500 enterprises plus tens of thousands of visitors. About 1,000 leaders from competitive packaging corporations attended the exhibition. It can be said that CHIPF2010 had a great impact upon world packaging industry. CHIPF 2012 will choose Better Packaging, More Success as a theme. The exhibition will focus on packaging design, new packaging materials application, simple packaging concept, packaging recycling and packaging safety. 

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